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Leading developer of flip-chip VCSEL technology for 3D sensing, TriLumina has launched the world’s first surface-mount flip-chip back-emitting VCSEL array without the need for a sub-mount or bond wires. This will allow in lowering costs and achieving higher performance than existing designs using near-infrared light-emitting laser diodes or LEDs for 3D sensing.
Conventional VCSEL (Vertical-Cavity Surface-Emitting Laser) arrays are mounted on a sub-mount and use bond wires for electrical connections. TriLumina’s unique patented Flip-chip, back-emitting VCSEL technology has been flip-chip packaged and used in automotive long-range LiDAR prototypes, for low power mobile and in-cabin 3D sensing applications. The new 4 W Chip-on-Board (CoB) SMT (surface mount technology) VCSEL device is a compact, surface-mountable design, consisting of a single VCSEL array die, that is mountable on a printed circuit board (PCB) without the need for a sub-mount carrier for the VCSEL die.
This tiny, very low-cost illumination technology is an excellent solution for numerous 3D sensing applications, as well as providing innovative NIR illumination options for replacing existing LEDs in solutions such as NIR camera systems, mobile cameras, in-cabin occupant monitoring and AR/VR systems. TriLumina’s integrated back-side etched micro-lenses enable integrated optics, which further reduces part height as compared to conventional VCSELs with separate optical lenses and can result in lower battery drain with multi-zone operation. It has the smallest footprint with the lowest cost implementation in its class, making it ideal for use in mobile devices.
The new architecture from TriLumina has excellent thermal properties with a very compact form factor. The VCSEL device has integrated solder balls and mounts directly to a PCB using standard surface mount technology (SMT), with built-in hermeticity. The CoB SMT VCSEL array eliminates the need for wire bonds or other expensive packaging technology found on standard top-emitting VCSELs. Although the device is designed for efficient operation in indirect Time of Flight (ToF) applications, the lack of wire bonds also has inherently low parasitic inductance, making this emitter compatible with ultra-high-resolution, fast rise-time, short pulse-width direct ToF applications.