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Teradyne, a US-based designer and manufacturer of automatic test equipment (ATE), announced that it has entered into a definitive agreement to acquire Quantifi Photonics, a leader in photonic IC testing. The acquisition is expected to close in the second quarter of 2025, subject to customary closing conditions and regulatory approval.

This acquisition will enable Teradyne to deliver scalable photonic integrated circuit (PIC) test solutions. PIC technology is leveraging wafer-based manufacturing, multi-die integration, and advanced packaging with high-speed I/O interfaces to enable the rapidly evolving high-performance Compute market to support AI workloads.

“The extraordinary growth and complexity driven by Cloud AI will require optical interconnect solutions to support the bandwidth and reduce the power required for next-generation networks,” said Teradyne CEO, Greg Smith. “We are thrilled to welcome the Quantifi Photonics team to Teradyne to accelerate the development of cost-effective, high-throughput test solutions for wafer-level, die/multi-die and co-packaged optical module testing.”

“By combining Quantifi Photonics’ deep expertise in photonic testing and Teradyne’s leadership in semiconductor ATE, we are uniquely positioned to revolutionize photonics high-volume manufacturing,” said Quantifi Photonics co-founder and CEO Iannick Monfils. “The silicon photonics market is at an inflection point that requires innovative, state-of-the-art solutions to unlock its full potential. By combining our strengths, Teradyne and Quantifi Photonics will provide customers with complete turn-key photonic test solutions that allow them to scale. Quantifi Photonics is excited to join the Teradyne family.”

Click here to learn more about PIC, Wafer, & Co-Packaged Optics Testing.