The HSMF-C11B from Broadcom is a Tricolor Top Mount ChipLED which uses Aluminum Indium Gallium Phosphide (AllnGaP) and Indium Gallium Nitride chip technology that enables this product to deliver industry-leading light output performance. The chipLED is compatible with reflow soldering processes. This LED is available in a very small package size of 1.08 mm × 1.08 mm and it has the thinnest package height in Broadcom's tricolor ChipLED family. This ultra-thin profile feature makes this LED ideal for applications that require low package height such as for indicators and backlighting, and the small package footprint allows the LEDs to be capable of supporting assembly in a close pitch configuration. For easy pick-and-place, the parts are packed in 8 mm tape and 7-inch diameter reel. Every reel is shipped from a single intensity and color bin for better uniformity control.